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Round-Robin Ranking

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Round-robin ranking (RRR) is a priority management and decision-making tool. The concept behind RRR is that when faced with multiple options, it is difficult to determine the best one. Our brain can effectively compare and choose between two options at a time. Therefore, RRR encourages us to compare all possible combinations of options. Based on your choices, the system ranks the options and identifies the “winners”. RRR is an excellent tool for ranking and establishing priorities.

What can you gain from Round-Robin Ranking?

Round-robin ranking is a creative thinking tool that helps manage the priority of tasks, options, and items and facilitates decision-making. RRR is an excellent analytical instrument that encourages you to reconsider each available option repeatedly and make appropriate decisions. It is useful for:

  • Selecting the best option among multiple choices
  • Managing priorities for tasks, ideas, failures, and thoughts
  • Making decisions when dealing with various possibilities
  • Avoiding conflicting discussions during collective decision-making

When should you use the Round-Robin Ranking?

The Round-Robin Ranking (RRR) can be successfully applied whenever there are more than two options available. Here are some examples of situations where RRR is useful:

  • Equipment and process troubleshooting
  • Task management
  • Idea ranking during brainstorming sessions
  • Action management for implementing process changes
  • Action administration for introducing new products

You can also get creative and find many other situations where RRR can be useful.

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Showcasing Successful Projects

Microelectronics

Wafer cleaning issues at the wet process

Wet cleaning is widely used in microchip manufacturing. Single wafer equipment is working as follows. A wafer rotates, and chemistry is poured from a movable nozzle. Water rinsing is performed at the end of the process. Loading of a new batch of the chemistry resulted in excursion - a strongly increased amount of defects was observed on the wafer after the processing. The project is dedicated to the failure analysis and creation of innovative solutions.

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Microelectronics

Optimizing IC Interconnection: A Functional Approach to Innovation (Stay updated on the project's progress)

Semiconductor devices are becoming more complex and expensive. But what exactly are we paying for when we buy a computer, cellphone, or any device containing a microchip? It’s not for radically new functions—the core components remain the same: transistors and interconnections. According to Moore’s law, transistors are getting smaller, with more interconnection layers added, making the manufacturing process longer and more costly.In reality, we’re paying for the inability of engineers to efficiently solve engineering challenges.This project leverages System Functional Modeling (SFM) to analyze the IC interconnection layer and Process Functional Modeling (PFM) to evaluate its manufacturing process. These analyses aim to deepen our understanding of both the device and the production process, generating innovative solutions for cost reduction and improved efficiency.

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Microelectronics

SiO2 thin film creation in Diffusion furnace - Process Functional Modeling

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Environment

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A good example of how to use 40 Inventive Principles for ideas generation.

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Mechanics

Functional Modeling of a Vacuum Cleaner: A Pathway to Innovation

This project showcases how functional modeling can drive innovation by analyzing and simulating various versions of a vacuum cleaner. By studying the functional model, you will experience firsthand how the Functional Modeling creative thinking tool helps identify opportunities for improvement and generate innovative ideas for the next generation of products.Through this example, you’ll learn how to dissect the functionality of a vacuum cleaner, revealing ways to enhance its performance, efficiency, and user experience—ultimately paving the way for future innovations.

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Wafer breakage at flash heating

Flash heating of a wafer is widely used in microchip manufacturing. The purpose of the process is to prevent the diffusion of ions and atoms. During the flash process, a wafer breakage occurs. The project's purpose is to learn and understand the mechanism of the wafer breakage and propose the solutions to prevent the wafer breakage

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מניעת עיבוי על העדשות - רוני עוז ותומר קליין

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Environment

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