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9 Windows is a creative thinking tool that is excellent for the generation of new ideas. It makes us think inventively, taking into consideration space and time. 9 Windows helps to predict the future based on analysis of past to present development occurring within a certain system. However, the future is exactly what we need; any new idea should be about a future; otherwise, this is not a new idea but not what we need.

What can you gain from 9 Widows?

9 Windows encourages a logical, systematic examination of correlations across time and space. This approach compels us to understand the structure of a system in both historical and current contexts, thereby suggesting future pathways for development and innovation. It excels at visually representing problems within their spatial and temporal dimensions.

Consider these scenarios where you and your team can harness the advantages of 9 Windows:

  • Gain insights into the historical and current structure of your system.
  • Formulate a strategic blueprint for future development.
  • Anticipate forthcoming customer needs.
  • Define problems and uncover innovative solutions.

When should you use the 9 Windows?

9 Windows is a versatile managerial creative thinking tool for system analysis and forecasting future development directions. It excels in problem-solving and fostering innovation, making it suitable for addressing both unexpected parameter deviations (excursions) and persistent issues.

Here are some scenarios where 9 Windows proves to be a valuable asset:

  • Crafting a strategy for research and development (R&D) and innovation.
  • Managing teamwork, involving problem analysis and idea generation.
  • Formulating strategies and tactics for startups.
  • Providing a condensed visualization of a system for monitoring and management.

While these examples highlight its utility, the 9 Windows thinking process can be flexibly applied in various other contexts, cementing its position as an essential tool for innovative problem-solving.

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Showcasing Successful Projects

Microelectronics

Optimizing IC Interconnection: A Functional Approach to Innovation (Stay updated on the project's progress)

Semiconductor devices are becoming more complex and expensive. But what exactly are we paying for when we buy a computer, cellphone, or any device containing a microchip? It’s not for radically new functions—the core components remain the same: transistors and interconnections. According to Moore’s law, transistors are getting smaller, with more interconnection layers added, making the manufacturing process longer and more costly.In reality, we’re paying for the inability of engineers to efficiently solve engineering challenges.This project leverages System Functional Modeling (SFM) to analyze the IC interconnection layer and Process Functional Modeling (PFM) to evaluate its manufacturing process. These analyses aim to deepen our understanding of both the device and the production process, generating innovative solutions for cost reduction and improved efficiency.

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Dr Anatoly Agulyansky
Microelectronics

Wafer cleaning issues at the wet process

Wet cleaning is widely used in microchip manufacturing. Single wafer equipment is working as follows. A wafer rotates, and chemistry is poured from a movable nozzle. Water rinsing is performed at the end of the process. Loading of a new batch of the chemistry resulted in excursion - a strongly increased amount of defects was observed on the wafer after the processing. The project is dedicated to the failure analysis and creation of innovative solutions.

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Dr. Anatoly Agulyansky
Microelectronics

SiO2 thin film creation in Diffusion furnace - Process Functional Modeling

The process is related to microelectronics - microchip manufacturing.The purpose of the process is to create a SiO2 layer on the surface of a Si wafer. Equipment: Vertical furnace to heat the wafers in the Q2 atmosphere and perform oxidation on the wafer surface. Process: The oxidation occurs on the front side and on the back side of the wafer Requirements: Create a SiO2 thin layer with a certain thickness and low sigma - low standard deviation of the thickness between the wafers and within the waferFailure: Wafers from the lower zone have higher thickness and significantly higher within wafer sigma (standard deviation of the thickness within the wafer)

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Dr. Anatoly Agulyansky
Environment

Targets splinters after trapshooting contaminate the nature - how to solve this problem

A good example of how to use 40 Inventive Principles for ideas generation.

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Dr. Anatoly Agulyansky
Mechanics

Functional Modeling of a Vacuum Cleaner: A Pathway to Innovation

This project showcases how functional modeling can drive innovation by analyzing and simulating various versions of a vacuum cleaner. By studying the functional model, you will experience firsthand how the Functional Modeling creative thinking tool helps identify opportunities for improvement and generate innovative ideas for the next generation of products.Through this example, you’ll learn how to dissect the functionality of a vacuum cleaner, revealing ways to enhance its performance, efficiency, and user experience—ultimately paving the way for future innovations.

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Dr. Anatoly Agulyansky
Microelectronics

Wafer breakage at flash heating

Flash heating of a wafer is widely used in microchip manufacturing. The purpose of the process is to prevent the diffusion of ions and atoms. During the flash process, a wafer breakage occurs. The project's purpose is to learn and understand the mechanism of the wafer breakage and propose the solutions to prevent the wafer breakage

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Dr. Anatoly Agulyansky
Chemistry

מניעת עיבוי על העדשות - רוני עוז ותומר קליין

?כיצד נוכל למנוע הצטברות של אדים על גבי העדשה בתנאי סביבה שונים כדי לשפר את הראייה והבטיחות

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Roni Oz
Environment

Recycling waste of solar panels.students: Alaa & saed

Excited to share our latest project at Ben-Gurion University of the Negev! 🚀 We tackled the pressing issue of solar panel waste and explored innovative recycling solutions to make solar energy truly sustainable.Key insights:Solar panel waste could hit 78 million metric tons by 2050. Only 10% of panels are currently recycled in the EU. Our project highlights the need for efficient recycling technologies, better regulations, and economic incentives to drive sustainable practices.Let’s work together for a greener future! 🌱

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Saed Hasson