PRIZ helps engineering teams model complex problems, understand failure mechanisms, and systematically develop innovative solutions that improve yield, quality, and manufacturing cost.
PRIZ gave our team a structured way to move from firefighting to real root-cause thinking. It helped us align faster and turn investigations into reusable learning.
PRIZ Guru gives you a guided, no-guesswork workflow for root cause analysis, process improvement, and systematic innovation, so you spend less time firefighting and more shipping reliable, profitable outcomes.
PRIZ helped us stop jumping to fixes and first understand what was really happening.
The value was not just solving one issue. It was finally seeing why the problem kept coming back.
The discussion shifted from opinions to mechanisms, actions, and measurable business impact.
PRIZ gave the team a disciplined way to connect symptoms, process conditions, and root-cause hypotheses.
It gave engineers a shared language. The meetings became clearer, faster, and less political.
PRIZ Guru is a methodology-first innovation platform that systematizes problem solving and helps teams generate the innovative solutions companies need to stay competitive and profitable. With a unified toolkit of structured methods and processes, PRIZ strengthens engineering thinking and promoting seamless communication among all stakeholders.
Our platform offers a range of creative thinking tools that help you think outside the box and develop new, innovative solutions.
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Guided facilitation walks teams through a structured, repeatable process that strengthens engineering thinking, drives continuous improvement, and embeds consistent learning across the organization. Works fully without AI; an optional assistant can speed feedback, research, and reporting.
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Our platform offers a seamless integration between project management and your problem-solving process.
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Our platform promotes open communication, shared goals, conflict resolution, collective ownership, trust, and positive relationships among all stakeholders.
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Engineers no longer have to do the most boring part of problem-solving - writing a report for stakeholders - as the report is automatically generated for them.
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The ultimate goal of every project is to generate innovative ideas and solutions. PRIZ Platform's idea management provides full transparency of all ideas and decisions made throughout a project.
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This project investigates radial non-uniformity of CDO low-k dielectric deposited by PECVD and its possible impact on wafer performance. Final test data indicate that faster dies are mainly located closer to the wafer center, while slower dies are more often found near the wafer periphery. The corresponding RC-delay trend also increases toward the wafer edge. The focus of the project is the capacitance component of RC-delay. CDO is expected to provide a low dielectric constant between BEOL metal lines, but the deposited film may not have uniform properties across the wafer. Near the wafer edge, the process can be influenced by different gas flow, plasma behavior, residence time, temperature, and pumping conditions. This may lead to stronger oxidation and deeper precursor decomposition near the periphery, forming CDO that is more oxygen-rich, less carbon-rich, denser, and closer in behavior to SiO₂. As a result, the dielectric constant k may increase toward the wafer edge, causing higher interline capacitance, higher RC-delay, and lower die speed. The project uses Functional Modeling to understand how PECVD chamber components and process conditions affect CDO film properties. The goal is to identify the main functional and problematic interactions and propose directions for compensation, such as radial gas-flow tuning, multi-zone showerhead design, edge compensation flow, and local plasma or temperature control.
Wet cleaning is widely used in microchip manufacturing. Single wafer equipment is working as follows. A wafer rotates, and chemistry is poured from a movable nozzle. Water rinsing is performed at the end of the process. Loading of a new batch of the chemistry resulted in excursion - a strongly increased amount of defects was observed on the wafer after the processing. The project is dedicated to the failure analysis and creation of innovative solutions.
This project investigates the nonuniform erosion of an expensive Ta sputtering target during Ta/TaN PVD. A deep racetrack groove forces target replacement while a significant amount of tantalum remains unused. Using PRIZ problem-solving tools, the project explores the system’s functions, identifies the root causes of localized erosion, and develops ways to improve target utilization without reducing deposition rate or production throughput.
The process is related to microelectronics - microchip manufacturing. The purpose of the process is to create a SiO2 layer on the surface of a Si wafer. Equipment: Vertical furnace to heat the wafers in the Q2 atmosphere and perform oxidation on the wafer surface. Process: The oxidation occurs on the front side and on the back side of the wafer Requirements: Create a SiO2 thin layer with a certain thickness and low sigma - low standard deviation of the thickness between the wafers and within the wafer Failure: Wafers from the lower zone have higher thickness and significantly higher within wafer sigma (standard deviation of the thickness within the wafer)
We offer a variety of courses to help you learn how to use our app to solve problems. Our courses are designed for users of all skill levels, from beginners to experienced users. Our courses include video lessons, hands-on exercises, and support from experienced instructors.
